| abstract |
An object of the present invention is to obtain a liquid crystalline resin composition having higher thermal conductivity. A highly heat conductive resin composition comprising a mesogen-containing epoxy resin (A), a specific aromatic amine curing agent (B), and a heat conductive filler (C), wherein the component (C) is: A highly thermally conductive resin composition characterized by being 5 parts by weight or more and 150 parts by weight or less with respect to 100 parts by weight of the total of the component (A) and the component (B). [Selection figure] None |