http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006244835-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24
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filingDate 2005-03-02^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46e7a3ecae6ded2979dc30b90dc79ade
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bb7034346b94fd41604bfd247b36dd9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4814399a756b7d6d8db96e9460e515e9
publicationDate 2006-09-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006244835-A
titleOfInvention Plasma processing apparatus and plasma processing method
abstract PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of reducing static charges on a workpiece. At least one surface of an electrode is covered with a dielectric cover. By disposing a plurality of electrodes 1 and 1 so that the surfaces covered with the dielectric cover 2 are opposed to each other, a discharge space 3 is formed between the opposed electrodes 1 and 1. By introducing a gas G into the discharge space 3 and applying a voltage between the opposing electrodes 1 and 1, plasma P is generated in the discharge space 1 and 1 under a pressure near atmospheric pressure. The present invention relates to a plasma processing apparatus for performing plasma processing on an object to be processed S by blowing out the plasma P from a lower opening of a discharge space 3 and supplying the plasma to the object to be processed S. A conductor 4 covered with a dielectric is provided below the electrode 1 and the conductor 4 is grounded. [Selection] Figure 1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012002479-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007026781-A
priorityDate 2005-03-02^^<http://www.w3.org/2001/XMLSchema#date>
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