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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00
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filingDate 2005-04-20^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d8624eafda6838be0f372140c58e6fd
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publicationDate 2006-11-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006299089-A
titleOfInvention Resin composition for direct plating and plated decoration products.
abstract 【Task】 To provide a resin composition for direct plating excellent in resin performance such as a balance of plating precipitation and plating adhesion strength, impact resistance and heat resistance in an electro copper plating process of a PC / ABS resin in a direct plating method. [Solution] A composition comprising 20 to 80% by weight of a polycarbonate resin (A) and 80 to 20% by weight of a rubber reinforced styrene resin (B), wherein the rubber reinforced styrene resin (B) is produced by emulsion polymerization. A resin composition for direct plating comprising a styrene resin (b-1) and a rubber-reinforced styrene resin (b-2) produced by bulk polymerization and / or solution polymerization. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014051563-A
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