| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c06ff00cc23d0d0c48233a171dccb984
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59fab83c03b67b915fbf17db465f72d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F279-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F279-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L55-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F291-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 |
| filingDate |
2006-11-20^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-04-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_703033836b8f314a243a23aec3bc4400 |
| publicationDate |
2016-04-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9315662-B2 |
| titleOfInvention |
Resin composition for direct metal plating, molded article, and metal-plated molded article |
| abstract |
The objective of the present invention is to provide a resin composition for direct plating whose plating performance such as depositibility and appearance after forming a metal film including copper film and the like by electroplating in direct plating method is excellent, a molded article comprising this composition, and a plated article having a metal film or an alloy film, formed by direct plating. The present composition is a thermoplastic resin composition containing a rubber-reinforced vinyl-based resin and the rubber-reinforced vinyl-based resin comprises a diene-based rubbery polymer [a1] and an ethylene•α-olefin-based rubbery polymer [a2], the total amount of the diene-based rubbery polymer [a1] and the ethylene•α-olefin-based rubbery polymer [a2] is from 3 to 30% by mass based on the thermoplastic resin composition, and the ratio of the ethylene•α-olefin-based rubbery polymer [a2] to the total amount is from 0.01 to 0.4. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11427706-B2 |
| priorityDate |
2005-11-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |