| abstract |
[PROBLEMS] To laminate on a bump electrode surface of a semiconductor wafer with a bump electrode, which can be cut at high speed without cutting powder or chipping during dicing, and has good recognition of alignment marks during dicing and flip chip mounting. To provide an adhesive composition for a semiconductor excellent in storage stability and connection reliability by heating and pressing in a short time. An adhesive composition for a semiconductor formed on a bump electrode surface of a semiconductor wafer, comprising (a) an organic solvent-soluble polyimide, (b) an epoxy compound, (c) a latent curing agent, For semiconductors, wherein the epoxy compound contains a solid epoxy compound and a liquid epoxy compound, and (c) the latent curing agent is 10 to 35 parts by weight with respect to 100 parts by weight of the epoxy compound. Adhesive composition. [Selection figure] None |