| abstract |
An object of the present invention is to provide a bonding method suitable for bonding a structure to which bonding by laser internal heating is difficult to apply. In an adhesive used for joining an adherend made of a first resin material and a second adherend by heat curing of the adhesive by a high frequency dielectric heating method, the adhesive is: A frequency of 28 MHz that is sensitive to high frequency dielectric heating performed under the application of a high frequency of 28 MHz or 40 MHz and that is dispersed in an amount of at least 1% by weight of an adhesive component in the adhesive component. Or it comprises so that it may contain the high frequency absorptive filler which has a high dielectric loss factor which can be heated by the application of a high frequency of 40 MHz. [Selection] Figure 1 |