| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2451-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J129-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B17-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-441
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B6-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J125-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B6-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J131-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B6-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B6-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B6-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
2017-10-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f875033cd8442b47099e7c06408337ef |
| publicationDate |
2018-05-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018079356-A1 |
| titleOfInvention |
Dielectric-heating bonding film and bonding method using dielectric-heating bonding film |
| abstract |
Provided are: a dielectric-heating bonding film that can achieve secure bonding even when a dielectric heating treatment is short; and a bonding method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that is for bonding a pair of adherends that comprise the same or different materials by means of a dielectric heating treatment. The dielectric-heating bonding film contains a thermoplastic resin as an A component and a dielectric filler as a B component and satisfies conditions (i) and (ii). (i) The melting point or softening point of the dielectric-heating bonding film as measured in compliance with a method prescribed by JIS K 7121 (1987) is within the range of 80℃–200℃. (ii) The heat of fusion of the dielectric-heating bonding film as measured in accordance with JIS K 7121 (1987) is in the range of 1–80 J/g. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023054114-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020070365-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020163786-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021201173-A1 |
| priorityDate |
2016-10-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |