http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010010706-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10cfc10171f0e204339e96e62a544ce0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2009-10-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6090e4ca4bee4e667d2d5d6d3a08bac0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eb42edd281af0eaa6a4d4575786181d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100e7d526cf8ae65dd50698a5c9a49b1 |
| publicationDate | 2010-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010010706-A |
| titleOfInvention | Metal film polishing composition and metal film polishing method |
| abstract | PROBLEM TO BE SOLVED: To scrape copper to be embedded in a groove and a hole formed on a substrate surface when forming a copper wiring on a substrate surface using a damascene method in a mounting process of a semiconductor element by a system in package. In other words, an excess portion of the copper film is polished and removed in a short time without causing dishing, thinning, etc., and a polished surface having high flatness is obtained. A substrate 3 is placed on a polishing pad 2 attached to a polishing surface plate 1 in a CPM process in the damascene method so that a surface 3a to be polished of the substrate 3 is in contact with the polishing pad 2, and applied from above. When the pressure head 4 is pressed and the polishing surface 3a of the substrate 3 is polished by the rotation of the polishing platen 1 and the pressure head 4, a non-spherical colloidal is used as an abrasive for the polishing slurry supplied to the polishing pad 2. A metal film polishing composition containing silica, an organic acid, an oxidizing agent and a polishing rate accelerator, further containing a corrosion inhibitor, and the balance being water is used. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160112470-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180135279-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012028516-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016117855-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102269327-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102422952-B1 |
| priorityDate | 2009-10-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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