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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 2008-09-30^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e793791aeb549b106faa003a6d7c98a0
publicationDate 2010-03-18^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010061087-A
titleOfInvention Positive resist composition for electron beam, X-ray or EUV and pattern forming method using the same
abstract A positive resist composition having a small performance fluctuation due to fluctuations in baking conditions and a pattern forming method using the same are provided. (A) a resin that decomposes by the action of an acid to increase the dissolution rate in an alkaline aqueous solution, (B) a compound that generates an acid upon irradiation with actinic rays or radiation, and (C) is held at 120 ° C. for 15 minutes. A composition containing a nitrogen-containing basic group or a quaternary ammonium group having a volatilization amount of 10% or less, and (D) an organic solvent, wherein the total solid content in the composition Concentration is 1.0-4.5 mass%, (B) The total amount of the compound which generate | occur | produces an acid by irradiation of actinic light or a radiation is at least 10 mass% with respect to the total solid in this composition. A positive resist composition for electron beam, X-ray or EUV. And a pattern forming method using the same. [Selection figure] None
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