| abstract |
PROBLEM TO BE SOLVED: To provide biphenyl excellent in moisture absorption resistance, high heat resistance, low dielectric property, low thermal expansion property, and flame retardancy when used in a resin composition used for an insulating layer of a multilayer printed wiring board. Aralkyl-type cyanate ester resin, resin composition containing biphenyl aralkyl-type cyanate ester resin, and prepreg, resin sheet, laminate, multilayer printed wiring board, and semiconductor having excellent balance of characteristics using the resin composition A device is provided. A resin composition containing biphenylaralkyl-type cyanate ester resin, an epoxy resin, and a curing agent as essential components, and a resin sheet, a prepreg, a laminate, a multilayer printed wiring board, and a semiconductor using the resin composition apparatus. [Selection] Figure 1 |