| abstract |
Provided is a resin composition for prepregs, which exhibits good solubility in a solvent and is capable of easily producing a cured product that has excellent flame retardancy and low water absorption with high reproducibility. Also provided are: a prepreg using this resin composition for prepregs; a laminate; a printed wiring board; and the like. A resin composition for prepregs of the present invention contains at least (A) a cyanic acid ester compound that is obtained by cyanating a phenol-modified xylene formaldehyde resin, (B) an epoxy resin, and an inorganic filler. |