| abstract |
The present invention provides a thermally conductive resin composition capable of improving thermal conductivity so as to effectively dissipate heat from an electronic component to the outside. A heat conductive resin composition comprising two or more inorganic fillers in a total amount of 60 to 95% by mass, at least a first inorganic filler having a Mohs hardness of 4 or more, and a second conductive filler composition. A thermally conductive resin composition, wherein the Mohs hardness of the inorganic filler is 3 or less, and the ratio of the first inorganic filler to the second inorganic filler is 1: 1 to 0.01. [Selection figure] None |