http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010053224-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
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filingDate 2008-08-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5077cb0d2ab653befefa987602107f56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa078e15f5cff1eafaeff7da9015848f
publicationDate 2010-03-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010053224-A
titleOfInvention Thermally conductive resin sheet, thermal conductive plate, thermal conductive printed wiring board, and heat dissipation member
abstract The present invention provides a heat conductive resin sheet, a heat conductive plate, a heat conductive printed wiring board, and a heat radiating member that are excellent in heat conductivity and have sufficient adhesive strength with copper foil without impairing moldability. A carbon fiber nonwoven fabric obtained by bonding carbon fibers 2 having an average fiber diameter of 0.5 to 10 μm and a fiber length of 25 mm or less with a binder resin, and comprising a prepreg impregnated with a thermosetting resin 3 containing an inorganic filler 4. Thermally conductive resin sheet 1 comprising a thermal conductivity of 20 W / m · K or more as an inorganic filler, and a thermal conductive plate, a thermally conductive printed wiring board, and heat dissipation using the same Element. [Selection] Figure 1
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priorityDate 2008-08-27^^<http://www.w3.org/2001/XMLSchema#date>
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