http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017008412-A

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publicationDate 2017-01-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017008412-A
titleOfInvention Low fluorine tungsten deposition by sequential CVD process
abstract A method for forming a low stress tungsten film having a low fluorine content is provided. After the step (a) of depositing a tungsten nucleation layer by repeatedly exposing the substrate with alternating pulses of a reducing agent and a first tungsten-containing precursor for two or more cycles under a chamber pressure of 10 Torr or less. A method of forming a tungsten film comprising the step (b) of depositing bulk tungsten on the tungsten nucleation layer by exposing the substrate to alternating pulses of hydrogen and a second tungsten-containing precursor. And (c) further comprising depositing a second bulk tungsten layer by simultaneously exposing the substrate to the reducing agent and the third tungsten-containing precursor. A method wherein step (c) is performed every two or more cycles of step (b), wherein one cycle of step (b) includes a pulse of hydrogen and a pulse of a second tungsten-containing precursor. The method wherein the first tungsten-containing precursor is fluorine-free. [Selection] Figure 7
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