http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5114858-B2

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-462
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
filingDate 2006-03-28^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-01-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-01-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-5114858-B2
titleOfInvention Multilayer wiring board and manufacturing method thereof
priorityDate 2006-03-28^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109

Showing number of triples: 1 to 29 of 29.