| abstract |
PURPOSE: To obtain a highly sensitive and highly heat-resistant photosensitive polyimide resin composition having good adhesion and low modulus by mixing a copolymer of a siliconediamine with a polyamic acid with a styryl compound and a glycine compound as essential components. n CONSTITUTION: A photopolymer composition is formed by mixing a copolymer (A) of 0.5-25wt.% siliconediamine of formula I (wherein (n) is 1-50) with 99.5-75wt.% polyamic acid having repeating units of formula II (wherein R 1 is a tri or tetra-valent organic group; R 2 is a bivalent organic group; R 3 is a C-C double bond-containing group; and (m) is 1-2) with a sensitizer (B) [a styryl compound of formula III (wherein R 4 is H, CH 3 , C 2 H 5 or C 6 H 5 ; and R 5 is benzooxazolyl or the like)] and an initiator (C) [a glycine compound of formula IV (wherein R 6 is H, CH 3 , C 2 H 5 , C 6 H 5 or the like] as essential components. The amounts of the components are such that 1-10 pts.wt. component B and 1-20 pts.wt. component C are used per 100 pts.wt. component A. n COPYRIGHT: (C)1991,JPO&Japio |