http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05175064-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d70c1fca1b1dc7e39595df39371b0fcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F41-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06 |
| filingDate | 1991-12-20^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16e010255b4ecddf465d95814a97d282 |
| publicationDate | 1993-07-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05175064-A |
| titleOfInvention | Method for manufacturing laminated electronic component |
| abstract | (57) [Summary] [Purpose] To provide a method for manufacturing a laminated electronic component which is excellent in lamination accuracy and which prevents lamination deviation in the transfer / lamination process. [Structure] First, an internal conductor pattern 3 and a positioning mark 4 are formed on a transfer peeling film 2 by using a conductive paste. Are printed at the same time, and the positioning marks 4 and the supporting tool 5 are aligned with each other, and are fixed to the supporting tool 5 in parallel at regular intervals in the stacking direction. On the other hand, the green sheet 1 having the through holes is also fixed to the support 5 in parallel with the same spacing as described above. Next, the peeling films 2 for transfer are arranged so as to be inserted one by one in the space between the green sheets 1 adjacent to each other in the stacking direction, the dummy sheets 6 are arranged above and below the peeling film 2, and then pressure is applied in the stacking direction. By doing so, the transfer is performed simultaneously at the same time. After the transfer, the transfer release film 2 is removed and thermocompression-bonded, and after debinding and firing, Bake external electrodes. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6780267-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016134477-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6402866-B1 |
| priorityDate | 1991-12-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 20 of 20.