| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-481 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 |
| filingDate |
2000-09-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-08-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_574f639bc0eb9cae6649b8d0dad1f6be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e411ac2dab90ad250163bdad46d2b563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b83335c3127edfb2b6de80d05d39bf9 |
| publicationDate |
2004-08-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6780267-B1 |
| titleOfInvention |
Electronic device of ceramic |
| abstract |
A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008099126-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9576728-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7819996-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099242-B2 |
| priorityDate |
1999-09-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |