| abstract |
PROBLEM TO BE SOLVED: To provide a polishing method for a silicon semiconductor wafer capable of reducing particles adhering to a wafer surface without lowering a haze level and a surface roughness improving characteristic in mirror polishing of a silicon semiconductor wafer. Of a composition for use. SOLUTION: The following (a) to (e) or (a) to A polishing composition for a silicon semiconductor wafer, comprising (c) and (d '). (A) silicon dioxide (b) water (c) water-soluble polymer compound (d) basic compound (e) compound having 1 to 10 alcoholic hydroxyl groups (d ') containing 1 to 10 alcoholic hydroxyl groups Nitrogen basic compounds |