http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S60156773-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cff62ee19588f053fe1f229df4e6c756
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-45
filingDate 1984-01-25^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec84dfb73339ac8f5b2f89eaf7499ed0
publicationDate 1985-08-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60156773-A
titleOfInvention Conductive coating
abstract PURPOSE: To provide the titled coating of great settling-proof ability for the conductive fine powder incorporated therein, for use in circuit paste, electromagnetic shielding agent etc., comprising said conductive fine powder and specific fatty acid amide in specific proportion. n CONSTITUTION: The objective composition comprising (A) 40W60wt% of conductive fine powder (e.g. of nickel carbonyl) and (B) 0.1W10wt% of an aliphatic acid amide of either formula RCONH 2 or (RCONH) 2 A (R is 5W21C alkyl; A is 1W6C alkylene) (pref. ethylenebisstearoamide, behenic acid amide or polyethylene wax- based amide). n COPYRIGHT: (C)1985,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008282763-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001155543-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105623446-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4639411-B2
priorityDate 1984-01-25^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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