http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63265488-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
filingDate 1987-04-23^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c8719ef0d26e5beef94ce80a811899e
publicationDate 1988-11-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S63265488-A
titleOfInvention Printed circuit board
abstract PURPOSE: To avoid the abnormal rise of a continuity resistance by a method wherein base is impregnated with epoxy resin and cured and the resin is brought into a C stage to form a board and a through-hole formed in the board is filled with solventless copper powder-resin system paste and its surface parts are coated with epoxy resin system paint. n CONSTITUTION: When a hole 3 drilled in a paper base epoxy resin laminated board 2 whose both surfaces are coated with copper foils 1 is coated or filled with copper powder paint 4 composed of copper powder-epoxy resin of an A stage, stencil printing is applied to one or two surfaces and the copper powder paint is dried in the air to be in a set-to-touch state. At that time, the time, the resin in the copper powder is in a B stage. Then epoxy resin is applied over surface conductors and the copper powder paint application parts of the hole and dried in the air to be in a set-to-touch state to formresin paint layers 5. At that time, the resin paint is in a B stage. Then the epoxy resin paint and the copper powder paint are simultaneously heated to bring them into a C stage. With this constitution, an initial resistance can be stabilized at a low value and the variation of a PCT treatment can be reduced. n COPYRIGHT: (C)1988,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07170046-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE40947-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100332970-B1
priorityDate 1987-04-23^^<http://www.w3.org/2001/XMLSchema#date>
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