http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102265047-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0127 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0109 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00626 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2017-03-07^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102265047-B1 |
| titleOfInvention | Structure for device with integrated microelectromechanical systems |
| abstract | The present invention relates to a method for manufacturing a structure 410, 410', 410'', 420, 430, the method comprising: a) providing a donor substrate comprising a front surface and a rear surface; b) providing a support substrate (20); c) forming an intermediate layer 30 on the front surface of the donor substrate or on the support substrate 20; d) assembling a donor substrate and a support substrate 20, thereby disposing an intermediate layer 30 between the two substrates; e) thinning the back side of the donor substrate to form a soluble layer 100 of an available thickness having a first face and a second free face 12' disposed on the intermediate layer 30; and • the donor substrate comprises, between the stop layer 2 and the front surface of the donor substrate, a microactive layer 3 and a buried stop layer 2 having a first thickness less than the usable thickness; After step e), the method comprises, in a first region 110 of the structure, a thick active layer 4 delimited by a second free face 12 ′ of the fusible layer 100 and a stop layer 2 . ), characterized in that it comprises the step of removing. |
| priorityDate | 2016-03-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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