http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030030587-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_563aab4a5b3f2dffef9f3ca7d18a9970
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
filingDate 2001-10-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c02073c7901e18ee15057eb7526e66f7
publicationDate 2003-04-18^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20030030587-A
titleOfInvention Led die bonder
abstract An LED die bonder is disclosed for bonding an LED chip to an LED lead frame. The LED die bonder has a loading unit for loading and loading the LED lead frame; A rail unit for receiving the LED lead frame loaded in the loading unit and repeating the movement of the LED lead frame by a predetermined pitch and fixing the fixed time; Dispensing unit for applying epoxy to the cup of the LED lead frame in the rail portion; A head unit for mounting the LED chip to a cup of the LED lead frame fixed at the rail unit; An ejection unit for separating the LED chip from the LED sheet so that the head unit accurately mounts the LED chip; An unloading unit configured to load the LED lead frame to which the LED chip is bonded; And a control unit for managing and adjusting each process.n n n As a result, the LED die bonder automatically improves workability and reduces production costs by automatically performing each process of the LED die bonder operation in a single facility. By taking pictures and inspecting with a camera, it is possible to check whether the work is done at any time, which greatly reduces the defective rate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104377277-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100880172-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101102825-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101111952-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101924170-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111769055-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102543801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101065724-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468558-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016108636-A1
priorityDate 2001-10-11^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

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