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filingDate 2003-04-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac07efe7464fa3c1971be55606c6cb48
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publicationDate 2004-11-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20040093255-A
titleOfInvention Methods of forming metal thin film and lanthanum oxide layer by ALD and method of forming high dielectric constant layer for semiconductor device
abstract A method of forming a high dielectric film made of a metal oxide is disclosed by a two-step ALD deposition process in which an oxygen depleted metal oxide film and a metal oxide film are sequentially formed. In the present invention, an oxygen-deficient metal oxide film made of a metal oxide having an oxygen content less than stoichiometric amount is formed on a semiconductor substrate by an ALD process using a first reactant made of an organometallic compound. A metal oxide film is formed on the oxygen depleted metal oxide film by an ALD process using the second reactant comprising the first reactant and the oxidant. In order to form a lanthanum oxide film by the method according to the present invention, after forming a first lanthanum oxide film having a La 2 O x (x <3) composition by an ALD process, a second lanthanum oxide film having a La 2 O 3 composition is formed thereon. Form. It is advantageous to use an alkoxide-based organometallic compound as the lanthanum source.
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