| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2004-07-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7c4b02bea977cf3372e7f5883e40aee |
| publicationDate |
2006-01-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060009413-A |
| titleOfInvention |
Multilayer Circuit Board Assembly |
| abstract |
The circuit board assembly may comprise an electrical element mounted on or in the assembly; A conductor layer electrically connected to the electrical element; A high temperature heat dissipating resin made of an insulating material and disposed to dissipate heat generated in the assembly; And molding resin surrounding the electrical element. Heat generated in the electrical components of the circuit board assembly is dissipated and dissipates throughout the assembly through the high temperature heat dissipation material. In addition, since the high temperature heat dissipating resin is made of an insulating material, it is not necessary to consider the short-circuit problem in the assembly.n n n n Circuit Board Assembly, Conductor Layer, High Temperature Heat Resistant |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103188862-A |
| priorityDate |
2004-07-21^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |