patent/TW-442360-B

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ddbd9538efce6e134d471b912946264e
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate	1998-02-24^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2001-06-23^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c723d4d11a56fcbd6afffcfc3972822b
publicationDate	2001-06-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-442360-B
titleOfInvention	CMP device with temperature control
abstract	This invention relates to a chemical mechanical polishing (CMP) device with temperature, utilizing a heating device to heat the storage device for object to be polished, the transporting device, the polishing pad, and the tray to a set temperature, and precisely controlling the temperature of whole system by a central temperature control unit, to obtain the best chemical mechanical polishing result.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108687653-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I566883-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8439723-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104842259-B
priorityDate	1998-02-24^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

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