| abstract |
The subject of the present invention is to provide a photosensitive siloxane composition with high sensitivity and high residual film rate characteristics. The composition has high resolution, high heat resistance, and high transparency, and does not increase the crosslinking agent or the siloxane compound. Molecular weight, and it is possible to suppress thermal sagging which is likely to occur during thermal curing.nn n n The solution of the present invention is a negative-type photosensitive polysiloxane composition, which is characterized by comprising (I) a polysiloxane, (II) an aromatic amidine compound which releases an acid by irradiating radiation, and (III) a solvent. |