http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10071461-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 |
| filingDate | 2015-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19533bed3af259865ff60a3015d89677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_349f550f694881e28237f8e5937502cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d12faaab890ecfee6174d049a93d91bb |
| publicationDate | 2018-09-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-10071461-B2 |
| titleOfInvention | Polishing pads and systems and methods of making and using the same |
| abstract | The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020078901-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11331767-B2 |
| priorityDate | 2014-04-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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