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filingDate 2015-10-19^^<http://www.w3.org/2001/XMLSchema#date>
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titleOfInvention LIFT printing of conductive traces onto a semiconductor substrate
abstract A method for metallization includes providing a transparent donor substrate ( 34 ) having deposited thereon a donor film ( 36 ) including a metal with a thickness less than 2 pm. The donor substrate is positioned in proximity to an acceptor substrate ( 22 ) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets ( 44 ) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace ( 25 ) in ohmic contact with the semiconductor material.
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