http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004241585-A1

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filingDate 2002-07-18^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-12-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2004241585-A1
titleOfInvention Method for forming image on object surface including circuit substrate
abstract By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer ( 4 ). This photosensitive paste layer ( 4 ) is plotted by a laser beam ( 8 ) so as to form a plotted area ( 7 ). The photosensitive paste layer ( 4 ) is developed and an exposed area ( 4 a ) or an unexposed area ( 4 b ) is removed so as to form a circuit pattern ( 17 ). This circuit pattern ( 17 ) is sintered to form a circuit pattern ( 20 ) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet ( 2 ) is used as the substrate, it is possible to form a ceramic substrate ( 18 ) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.
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