Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0514 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
filingDate |
2002-07-18^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29184aeae111351d075e57459ea8c5c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ce22dffbf4a0c8dac676c6395230428 |
publicationDate |
2004-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2004241585-A1 |
titleOfInvention |
Method for forming image on object surface including circuit substrate |
abstract |
By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer ( 4 ). This photosensitive paste layer ( 4 ) is plotted by a laser beam ( 8 ) so as to form a plotted area ( 7 ). The photosensitive paste layer ( 4 ) is developed and an exposed area ( 4 a ) or an unexposed area ( 4 b ) is removed so as to form a circuit pattern ( 17 ). This circuit pattern ( 17 ) is sintered to form a circuit pattern ( 20 ) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet ( 2 ) is used as the substrate, it is possible to form a ceramic substrate ( 18 ) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10633758-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10193004-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11422532-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015201489-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2957155-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2957155-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10622244-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9474162-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10520923-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011207048-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105530763-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014125470-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10537027-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10015887-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10994564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10688692-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11662711-B2 |
priorityDate |
2001-09-11^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |