| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-2861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-2902
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0293 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D04H1-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D21H13-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D04H1-587
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D04H1-64 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H13-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D04H1-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D04H1-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H27-00 |
| filingDate |
2000-02-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ff593e1b13c5de4eeadffc587c974b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_687ea72615bdc679ac7ed12ca464bed0 |
| publicationDate |
2003-03-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003045164-A1 |
| titleOfInvention |
Non-woven fabric material and prepreg, and circuit board using the same |
| abstract |
The present invention provides a nonwoven fabric material prepared from short fibers including thermal-resistant synthetic fibers bound with an inorganic binder, a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6887100-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005186839-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011218273-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002164467-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011224329-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6761790-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012315814-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9243132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004115989-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE42623-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7198515-B2 |
| priorityDate |
1999-02-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |