patent/US-2004076797-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004076797-A1

Outgoing Links

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filingDate	2002-10-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15f3efe6f9b53c16ad8049ab02c3c102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d3610827f24156d6f1cf9d40837fef3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d695b9a9de54223d7f697f977080628
publicationDate	2004-04-22^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2004076797-A1
titleOfInvention	Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
abstract	A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer and at least one opening in the packaging layer communicating with the at least one gap.
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priorityDate	2002-10-22^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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