| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2005-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-04-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_660bf6eeb7ba4cf379a9f12b529e85b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40c15bd63ef960f91ca01773e249083b |
| publicationDate |
2008-04-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7358615-B2 |
| titleOfInvention |
Microelectronic package having multiple conductive paths through an opening in a support substrate |
| abstract |
Microelectronic packages are disclosed. A microelectronic package may include a substrate having first and second sides. Passive components may be located on the first side of the substrate. Interconnects may also be located on the first side of the substrate, and may be electrically coupled with the passive components. Microelectronic components may be located on the first side of the substrate and may be electrically coupled with interconnects. The substrate may include an opening therein. The opening may lead from the second side of the substrate toward the first side of the substrate. A plurality of conductive paths may be at least partially included in the opening. Each of the conductive paths may lead from the second side of the substrate toward the first side of the substrate to communicate electrical signals to interconnects. Methods of making the packages and electronic devices including the packages are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008179756-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017170676-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008150164-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7804175-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7829987-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10014710-B2 |
| priorityDate |
2005-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |