Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dd8994f5c33817a453ab46f6509354a8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31745 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31732 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-32 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N5-00 |
filingDate |
2005-04-27^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_973af7ce7600b31a08233223708a4046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_418e2c1fef3e9deea80815da63a00aac |
publicationDate |
2006-11-02^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2006243919-A1 |
titleOfInvention |
TEM sample preparation from a circuit layer structure |
abstract |
A method of TEM sample preparation from a circuit layer structure, the method comprising electron-beam assisted deposition of a first protective layer over a site of interest of the circuit layer structure; ion-beam assisted deposition of a second protective layer over the first protective layer; and ion-beam milling at the site of interest through the first and second protective layers. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9006681-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008132734-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8143594-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012073009-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008132734-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010276607-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8557707-B2 |
priorityDate |
2005-04-27^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |