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filingDate 2007-10-19^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-02-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008038869-A1
titleOfInvention High performance system-on-chip using post passivation process
abstract The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.
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