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publicationDate 2010-06-10^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010144149-A1
titleOfInvention Method to selectively polish silicon carbide films
abstract The present invention provides a method for selectively removing silicon carbide from the surface of a substrate in preference to silicon dioxide. The method comprises abrading a surface of substrate with a polishing composition that comprises a particulate abrasive, at least one acidic buffering agent, and an aqueous carrier.
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