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publicationDate 2003-07-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003124850-A1
titleOfInvention Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device
abstract A polishing slurry for CMP of an SiC series compound film, includes colloidal silica having a primary particle diameter ranging from 5 nm to 30 nm, and at least one acid selected from the group consisting of an amino acid having a benzene ring and an organic acid having a heterocycle.
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