| abstract |
Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C 1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies. |