| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7220eb7b281df106f214e1f0f370a3f7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00801 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 |
| filingDate |
2009-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b677924e53bc48aa93513d254947ef8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b8b745e56e548dd98948039b4367a13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e2c61559e46d50879d3d56fbbac302 |
| publicationDate |
2010-11-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2010289065-A1 |
| titleOfInvention |
Mems integrated chip with cross-area interconnection |
| abstract |
The present invention discloses a MEMS (Micro-Electro-Mechanical System) integrated chip with cross-area interconnection, comprising: a substrate; a MEMS device area on the substrate; a microelectronic device area on the substrate; a guard ring separating the MEMS device area and the microelectronic device area; and a conductive layer on the surface of the substrate below the guard ring, or a well in the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106601693-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11148940-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019081192-A1 |
| priorityDate |
2009-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |