patent/US-3256465-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3256465-A

Outgoing Links

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filingDate	1962-06-08^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1966-06-14^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate	1966-06-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-3256465-A
titleOfInvention	Semiconductor device assembly with true metallurgical bonds
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type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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