| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f9098aa47c20f8fde8ab86da414e3ed3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3468
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10962
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10295 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-328
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-58 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
1979-06-01^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1980-12-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_534a8174f00c3a8a602a7bf8da312094 |
| publicationDate |
1980-12-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4242719-A |
| titleOfInvention |
Solder-weld P.C. board apparatus |
| abstract |
A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6657135-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4902606-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4965700-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11470880-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4542438-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4639566-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4982376-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9406817-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6739881-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4484170-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5144535-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5606263-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008144299-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014069490-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6570774-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5662987-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6299055-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4924353-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5073118-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010068398-A1 |
| priorityDate |
1979-06-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |