| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8efbae6056f7ee0275c50b0f1e7243be |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
1974-11-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1976-05-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a93158bc557031d885dfc7d51fa8de5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f099a77143d7f49eee5807799bedcb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0e14b2c632b59154ce45355e2c2a9dc |
| publicationDate |
1976-05-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-3956079-A |
| titleOfInvention |
Electrodeposition of copper |
| abstract |
This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups: |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4376685-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6776893-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4683036-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004104124-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012128888-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1308540-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9869029-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1148156-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6736954-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1148156-A3 |
| priorityDate |
1972-12-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |