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filingDate 1983-08-01^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1984-06-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4452664-A
titleOfInvention Method for predetermining peel strength at copper/aluminum interface
abstract A low temperature (about 0° C. to about 100° C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.
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