patent/US-5298685-A

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filingDate	1992-07-14^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1994-03-29^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate	1994-03-29^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5298685-A
titleOfInvention	Interconnection method and structure for organic circuit boards
abstract	Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.
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