| abstract |
A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable. |