Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 |
filingDate |
2000-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2004-03-23^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af58a4e48d9386bb9ec0c949a7ed1c7f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adccbf38a816cfaa1c69016d06765002 |
publicationDate |
2004-03-23^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6709609-B2 |
titleOfInvention |
Plasma heating of a substrate with subsequent high temperature etching |
abstract |
We have discovered a method of reducing the effect of material sputtered/etched during the preheating of a substrate. One embodiment of the method pertains to preheating a substrate which includes a metal-containing layer which is to be pattern etched subsequent to preheating. The method includes exposing the substrate to a preheating plasma which produces a deposit or residue during preheating which is more easily etched than said metal-containing layer during the subsequent plasma etching of said metal-containing layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8043433-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009199765-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006110688-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005118353-A1 |
priorityDate |
2000-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |