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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
filingDate 2000-12-22^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-03-23^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af58a4e48d9386bb9ec0c949a7ed1c7f
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publicationDate 2004-03-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6709609-B2
titleOfInvention Plasma heating of a substrate with subsequent high temperature etching
abstract We have discovered a method of reducing the effect of material sputtered/etched during the preheating of a substrate. One embodiment of the method pertains to preheating a substrate which includes a metal-containing layer which is to be pattern etched subsequent to preheating. The method includes exposing the substrate to a preheating plasma which produces a deposit or residue during preheating which is more easily etched than said metal-containing layer during the subsequent plasma etching of said metal-containing layer.
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priorityDate 2000-12-22^^<http://www.w3.org/2001/XMLSchema#date>
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