http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009199765-A1

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filingDate 2008-02-11^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-08-13^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2009199765-A1
titleOfInvention High efficiency electro-static chucks for semiconductor wafer processing
abstract The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck.
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