http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8623719-B2

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-785
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
filingDate 2012-11-28^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-01-07^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11ea9bc5338c802aed1bbae6f50e8569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc5c5f45af232f10ee777d2fdc7d16d
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publicationDate 2014-01-07^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8623719-B2
titleOfInvention Method for forming and structure of a recessed source/drain strap for a MUGFET
abstract A method and semiconductor structure includes an insulator layer on a substrate, a plurality of parallel fins above the insulator layer. Each of the fins has a central semiconductor portion and conductive end portions. At least one conductive strap is positioned within the insulator layer below the fins. The conductive strap can be perpendicular to the fins and contact the fins. The conductive strap includes recessed portions disposed within the insulator layer, below the plurality of fins, and between each of the plurality of fins, and projected portions disposed above the insulator layer, collinear with each of the plurality of fins. The conductive strap is disposed in at least one of a source region and a drain region of the semiconductor structure. A gate insulator contacts and covers the central semiconductor portion of the fins, and a gate conductor covers and contacts the gate insulator.
priorityDate 2010-09-07^^<http://www.w3.org/2001/XMLSchema#date>
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7262086-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007052027-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7301206-B2
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