| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac671d1f0fd0cbbea885d2a086a4f13d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14a59d61c3ef82f61ea33b5dd67b791c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e69fa17c472a65b4b37c673b8b46582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40554861c14e4795646df05ee4f9d4f2 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-015 |
| filingDate |
2012-04-24^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-06-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17d1f4fb00fc46cc46c66152aefa8715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f98be1b2a04ecf78320aa32aee57914c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f9e69d11d9aa0186bc0c3348ccc6486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e8b16df2817ad369399ccd5c62a2960 |
| publicationDate |
2015-06-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9067296-B2 |
| titleOfInvention |
Polishing method |
| abstract |
A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11318577-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021030351-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017218921-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11597052-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9970754-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114173991-A |
| priorityDate |
2011-04-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |