| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7604f0dde0a1f162f345fc6e89eb160
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_852f83e06c163f00914a7f828b52a03b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d2cd965a71edc2e34f901128848898c0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e20c349cd83e307f7dd80d7d9840256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3588ff720c2d7ce273b4a8d326f8a0a0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B31-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B31-00 |
| filingDate |
2011-11-07^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-07-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ee3ba93c65c6385e235dd18bff021ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46fdcc2206dc711ccd5857874040a28c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9165ea956843c3953a493389832eae1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9f852d895623bba52a0277e45d2c12b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a43321b021a2aab466d7d365a65bbd1f |
| publicationDate |
2015-07-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9090799-B2 |
| titleOfInvention |
Composition for polishing and method of polishing semiconductor substrate using same |
| abstract |
Provided is a polishing composition containing abrasive grains, at least one type of alcohol compound selected from the group consisting of aliphatic alcohols with 2 to 6 carbon atoms and glycol ethers with 3 to 10 carbon atoms, at least one type of basic compound selected from the group consisting of quaternary ammonium salts and alkali metal salts, and water. The average primary particle diameter of the abrasive grains is 5 to 50 nm. The content of the alcohol compound in the polishing composition is 0.01 to 1% by mass. The polishing composition is mainly used in an application of polishing a semiconductor substrate surface. |
| priorityDate |
2010-11-08^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |